Molecular Dynamics Simulation of Bulk Cu Material under Various Factors
نویسندگان
چکیده
In this paper, the molecular dynamics (MD) method was used to study influence of factors bulk Cu material, such as effect number atoms (N) at temperature (T), T = 300 K, T, and annealing time (t) with Cu5324 on structure properties, phase transition, glass Tg material. The obtained results showed that transition (Tg) material 652 K; length link for Cu-Cu had a negligible change; r 2.475 Å; four types structures, FCC, HCP, BCC, Amor, always existed. With increasing BCC decrease, Amorphous (Amor) increases. an time, increased, Amor decreased. simulated there great found gradient change, successful determination point above On basis these results, essential support will be provided future studies mechanical, optical, electronic properties.
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ژورنال
عنوان ژورنال: Applied sciences
سال: 2022
ISSN: ['2076-3417']
DOI: https://doi.org/10.3390/app12094437